Chang-Chi Lee,: search on Z-Library

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1

Anti-SARS coronavirus 3C-like protease effects of Isatis indigotica root and plant-derived phenolic compounds

Cheng-Wen Lin, Fuu-Jen Tsai, Chang-Hai Tsai, Chien-Chen Lai, Lei Wan, Tin-Yun Ho, Chang-Chi Hsieh, Pei-Dawn Lee Chao

Journal:

Antiviral Research

Year:

2005

Language:

english

File:

PDF, 332 KB

english, 2005

2

Honeysuckle aqueous extract and induced let-7a suppress dengue virus type 2 replication and pathogenesis

Lee, Ying-Ray, Yeh, Siao-Fen, Ruan, Xiao-Ming, Zhang, Hao, Hsu, Sheng-Da, Huang, Hsien-Da, Hsieh, Chang-Chi, Lin, Yee-Shin, Yeh, Trai-Ming, Liu, Hsiao-Sheng, Gan, Dai-Di

Journal:

Journal of Ethnopharmacology

Year:

2017

Language:

english

File:

PDF, 1.51 MB

english, 2017

3

Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 970 KB

english, 2010

4

Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages

Yi-Shao Lai,, Tong Hong Wang,, Chang-Chi Lee,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2008

Language:

english

File:

PDF, 1.13 MB

english, 2008

5

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Effect of Power Cycling Duration on Coupled Power and Thermal Cycling Reliability of Board-level Chip-scale Packages

Tong Hong Wang,, Yi-Shao Lai,, Chang-Chi Lee,

Year:

2005

Language:

english

File:

PDF, 3.18 MB

english, 2005

6

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 778 KB

english, 2011

7

Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages

Wang, Tong Hong, Lee, Chang-Chi, Lai, Yi-Shao, Lee, Kuo-Yuan

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 969 KB

english, 2009

8

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages

Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 914 KB

english, 2012

9

Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test

Tong Hong Wang,, Chang-Chi Lee,, Yi-Shao Lai,, Yu-Cheng Lin,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 1.49 MB

english, 2008

10

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages

Yi-Shao Lai,, Tong Hong Wang,, Chang-Chi Lee,

Year:

2005

Language:

english

File:

PDF, 1.07 MB

english, 2005

11

A High-Precision Bandgap Reference With a V-Curve Correction Circuit

Lee, Chang-Chi, Chen, Hou-Ming, Lu, Chi-Chang, Lee, Bo-Yi, Huang, Hsien-Chi, Fu, He-Sheng, Lin, Yong-Xin

Journal:

Year:

2020

File:

PDF, 829 KB

2020

12

Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly

Tong Hong Wang, Yi-Shao Lai, Chang-Chi Lee, Yu-Cheng Lin

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2009

Language:

english

File:

PDF, 1.54 MB

english, 2009

13

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Wang, Tong Hong, Lee, Chang-Chi, Lai, Yi-Shao, Lin, Yu-Cheng

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 479 KB

english, 2006

14

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic

England, Luke, Fisher, Daniel, Rivera, Katie, Guthrie, Bill, Kuo, Ping-Jui, Lee, Chang-Chi, Hsu, Che-Ming, Min, Fan-Yu, Kang, Kuo-Chang, Weng, Chen-Yuan

Year:

2019

Language:

english

File:

PDF, 541 KB

english, 2019

15

[IEEE 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) - YILAN, Taiwan (2019.5.20-2019.5.22)] 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) - Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology

Lee, Chang-Chi, Liu, Yu-Sung, Tseng, Chun-Hsiang, Chen, Jeng-Yue, Juang, Fuh-Shyang, Chang, Yung-Ying, Hsu, Hung-Chih

Year:

2019

Language:

english

File:

PDF, 781 KB

english, 2019

16

Development of Microcontroller Applied to Chlorine Ion Measurement System

Chou, Jung-Chuan, Chen, Chien-Cheng, Lee, Chang-Chi

Journal:

IEEE Sensors Journal

Year:

2012

Language:

english

File:

PDF, 666 KB

english, 2012

17

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile

Wang, Tong Hong, Tsai, Ching-I, Lee, Chang-Chi, Lai, Yi-Shao

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.13 MB

english, 2013

18

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader

Yi-Shao Lai,, Tong Hong Wang,, Chang-Chi Lee,, Hsuan-Yu Chen,

Year:

2006

Language:

english

File:

PDF, 380 KB

english, 2006

19

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

Wang, Tong Hong, Lai, Yi-Shao, Lee, Chang-Chi, Wang, Ching-Chun

Year:

2007

Language:

english

File:

PDF, 448 KB

english, 2007

20

[IEEE IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society - Taipei, Taiwan (2007.11.5-2007.11.8)] IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society - Application of Sun Protection Factor and Ultra Violet in Alarming Hat

Lin, Yi-Sian, Wang, Hsien-Yu, Lee, Chang-Chi, Shieh, Jen-Yu

Year:

2007

Language:

english

File:

PDF, 4.03 MB

english, 2007

21

Utilizing liver-specific microRNA-122 to modulate replication of dengue virus replicon

Tai-Chi Lee, Yi-Ling Lin, Jia-Teh Liao, Chih-Mao Su, Chang-Chi Lin, Wen-Po Lin, Ching-Len Liao

Journal:

Biochemical and Biophysical Research Communications

Year:

2010

Language:

english

File:

PDF, 1.35 MB

english, 2010

22

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Electrical, thermal and warpage investigation on high bandwidth PoP

Hung, Mike, Lee, Chang-Chi, Cheng, Hung-Hsiang, Cheng, Morris, Lin, Timmy, Lee, Ying-Chih, Kao, Chin-Li, Pan, Po-Chih

Year:

2013

Language:

english

File:

PDF, 462 KB

english, 2013

23

[IEEE 1998 International Conference on Consumer Electronics - Rosemont, IL, USA (1997.06.13-1997.06.13)] International Conference on Consumer Electronics - Design Of Video Service Engine With SCSI Interface For An ADSL-based Near Video On Demand System

Chi-Shoung Huang,, Wen-Deh Wang,, Huang-Cheng Huang,, Yinyi Lin,, Liang-Wei Lee,, Yin-Hwa Huang,, Chang-Chi Lai,, Bing-Shan Chien,, Yu-Chyuan Chang,, Chi-Shi Liu,, Bor-Sheng Jeng,

Year:

1997

Language:

english

File:

PDF, 195 KB

english, 1997

24

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Evaluation of Thermal Characteristics of Board-level High Performance Flip-chip Package Equipped with Vapor Chamber as Heat Spreader

Wang, Tong Hong, Lee, Chang-Chi, Liu, Rong-Tai, Lai, Yi-Shao, Yeh, Chang-Lin

Year:

2008

Language:

english

File:

PDF, 4.07 MB

english, 2008

25

[IEEE CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on Lasers and Electro-Optics (IEEE Cat. No.03TH8671) - Taipei, Taiwan (Dec. 15-19, 2003)] CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on Lasers and Electro-Optics (IEEE Cat. No.03TH8671) - Luminescence efficiency of ingan-based multiple quanyum well UV-leds

Chang-Chi Pan,, Chia-Ming Lee,, Wen-Jay Hsu,, Guan-Ting Chen,, Jen-Inn Chyi,

Year:

2003

Language:

english

File:

PDF, 43 KB

english, 2003

26

[IEEE 2016 5th International Symposium on Next-Generation Electronics (ISNE) - Hsinchu, Taiwan (2016.5.4-2016.5.6)] 2016 5th International Symposium on Next-Generation Electronics (ISNE) - Energy-efficient and torque enhanced brushless DC motor controller

Lee, Chang-Chi, Chiou, Gwo-Jen, Chen, Jeng-Yue, Tung, Yao-Chun, Lu, Shung-Hong, Juang, Fuh-Shyang, Chen, Shen-Yaur

Year:

2016

Language:

english

File:

PDF, 277 KB

english, 2016

27

Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

Yuan, Cadmus C. A., Lee, Chang-Chi

Journal:

Year:

2020

File:

PDF, 1.43 MB

2020

28

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - A Numerical Study of Board-level Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions

Wang, Tong, Lee, Chang-Chi, Wang, Ching-Chun, Lai, Yi-Shao

Year:

2006

Language:

english

File:

PDF, 4.30 MB

english, 2006

29

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling

Yuan, Cadmus, Hong, Yu-Jun, Lee, Chang-Chi, Chiang, Kou-Ning, Huang, Jin-Huang

Year:

2019

Language:

english

File:

PDF, 284 KB

english, 2019

30

Dang-Gui-Bu-Xai-Tang Modulated the Immunity of Tumor Bearing Mice

Hsieh, Chang-Chi, Lin, Wen-Chang, Lee, Miau-Rong, Hsu, Shih-Lan, Liu, Hsiao-Sheng, Kao, Shung-Te, Hsieh, Ming-Tsuen

Journal:

Immunopharmacology and Immunotoxicology

Year:

2003

Language:

english

File:

PDF, 314 KB

english, 2003

31

Effect of serum metabolites of Pueraria lobata in rats on peripheral nerve regeneration: In vitro and in vivo studies

Hsien-Tung Chen, Chun-Hsu Yao, Pei-Dawn Lee Chao, Yu-Chi Hou, Hsiu-Mei Chiang, Chang-Chi Hsieh, Cherng-Jyh Ke, Yueh-Sheng Chen

Journal:

Journal of Biomedical Materials Research Part B: Applied Biomaterials

Year:

2008

Language:

english

File:

PDF, 355 KB

english, 2008

32

High-powered thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests

Tong Hong Wang, Hsuan-Yu Chen, Chang-Chi Lee, Yi-Shao Lai

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 1.46 MB

english, 2011

33

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

Tong Hong Wang,, Paisner, Sara, Chang-Chi Lee,, Susan Chen,, Yi-Shao Lai,

Year:

2009

Language:

english

File:

PDF, 1.25 MB

english, 2009

34

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Lee, Chang-Chi, Hung, Cp, Cheung, Calvin, Yang, Ping-Feng, Kao, Chin-Li, Chen, Dao-Long, Shih, Meng-Kai, Chien, Chien-Lin Chang, Hsiao, Yu-Hsiang, Chen, Li-Chieh, Su, Michael, Alfano, Michael, Siegel,

Year:

2016

Language:

english

File:

PDF, 788 KB

english, 2016

35

[IEEE 2017 12th IEEE Conference on Industrial Electronics and Applications (ICIEA) - Siem Reap, Cambodia (2017.6.18-2017.6.20)] 2017 12th IEEE Conference on Industrial Electronics and Applications (ICIEA) - Implementation of a novel brushless DC motor controller

Lee, Chang-Chi, Chiou, Gwo-Jen, Chen, Jeng-Yue, Tung, Yao-Chun, Juang, Fuh-Shyang

Year:

2017

Language:

english

File:

PDF, 376 KB

english, 2017

36

Antiviral Activity of Compound L3 against Dengue and Zika Viruses In Vitro and In Vivo

Chuang, Fu-Kai, Liao, Ching-Len, Hu, Ming-Kuan, Chiu, Yi-Lin, Lee, An-Rong, Huang, Shih-Ming, Chiu, Yu-Lung, Tsai, Pei-Ling, Su, Bo-Cyuan, Chang, Tsung-Hsien, Lin, Chang-Chi, Shih, Chih-Chin, Yen, Li-

Journal:

International Journal of Molecular Sciences

Year:

2020

File:

PDF, 2.31 MB

2020

37

Reliability improvement of rapid thermal oxide using gas switching

Min Hung Lee,, Cheng-Ya Yu,, Fon Yuan,, Chen, K.-F., Chang-Chi Lai,, Chee Wee Liu,

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2003

Language:

english

File:

PDF, 311 KB

english, 2003

38

The gene for a human microfibril-associated glycoprotein is commonly deleted in Smith-Magenis syndrome patients

Zhao, Zhaoyang, Lee, Chang-Chi, Jiralerspong, Sarn, Juyal, Ramesh C., Lu, Fei, Baldini, Antonio, Greenberg, Frank, Caskey, C. Thomas, Patel, Pragna I.

Journal:

Human Molecular Genetics

Year:

1995

Language:

english

File:

PDF, 4.07 MB

english, 1995

39

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Yu-Hsiang, Chen, Chien-Fan, Yang, Ping-Feng, Lee, Chang-Chi, Liu, Min-Chi, Lin, Kwang-Lung, Chen, Chiao-Wen, Factor, Bradford J.

Year:

2014

Language:

english

File:

PDF, 1.37 MB

english, 2014

40

[IEEE 2015 IEEE 2nd International Future Energy Electronics Conference (IFEEC) - Taipei, Taiwan (2015.11.1-2015.11.4)] 2015 IEEE 2nd International Future Energy Electronics Conference (IFEEC) - A ds-qs axis transformation with adjustable angle for three-phase AC/DC converter

Jeng-Yue Chen,, Gwo-Jen Chiou,, Tsung-Cheng Chen,, Chi-Kai Lin,, Chang-Chi Lee,

Year:

2015

Language:

english

File:

PDF, 519 KB

english, 2015

41

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Next generation package-on-package solution to support wide IO and high bandwidth interface

Cheng, Hung-Hsiang, Lee, Chang-Chi, Chung, Ming-Feng, Pan, Po-Chih, Yang, Ping-Feng, Chiu, Chi-Tsung, Hung, Chih-Pin, Wang, Chen-Chao

Year:

2014

Language:

english

File:

PDF, 3.47 MB

english, 2014

42

Lifetime study for solution processed organic light emitting diodes

Juang, Fuh-Shyang, Lee, Chang-Chi, Chen, Jeng-Yue, Lin, Yen-Hua, Zhang, Ding-Wen

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2019

File:

PDF, 663 KB

2019

43

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 2.5D IC Micro-Bump Materials Characterization and IMCs Evolution Under Reliability Stress Conditions

Su, Michael, Black, Bryan, Hsiao, Yu-Hsiang, Changchien, Chien-Lin, Lee, Chang-Chi, Chang, Hung-Jen

Year:

2016

Language:

english

File:

PDF, 514 KB

english, 2016

44

A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation

Chen, Hou-Ming, Lee, Chang-Chi, Jheng, Shih-Han, Chen, Wei-Chih, Lee, Bo-Yi

Journal:

IEEE Transactions on Circuits and Systems I: Regular Papers

Year:

2017

Language:

english

File:

PDF, 3.17 MB

english, 2017

45

[IEEE IEEE International Symposium on Compound Semiconductors - San Diego, CA, USA (25-27 Aug. 2003)] 2003 International Symposium on Compound Semiconductors - Luminescence efficiency of InGaN multiple quantum well UV-LEDs

Chang-Chi Pan,, Chia-Ming Lee,, Wen-Jay Hsu,, Guan-Ting Chen,, Jen-Inn Chyi,

Year:

2003

Language:

english

File:

PDF, 96 KB

english, 2003

46

The Roughness-Enhanced Light Emission from Metal-Oxide-Silicon Light-Emitting Diodes Using Very High Vacuum Prebake

Lee, Min-Hung, Chen, Kuan-Fu, Lai, Chang-Chi, Liu, Chee Wee, Pai, Woei-Wu, Chen, Miin-Jang, Lin, Ching-Fuh

Journal:

Japanese Journal of Applied Physics

Year:

2002

Language:

english

File:

PDF, 66 KB

english, 2002

47

Design of video service engine with SCSI for an ADSL-based near video on demand system

Chih-Shoung Huang, Wen-Deh Wang, Liang-Wei Lee, Yinyi Lin, Huang-Cheng Huang, Yin-Hwa Huang, Chang-Chi Lai, Bing-Shan Chien, Yu-Chyuan Chang, Chi-Shi Liu, Bor-Sheng Jeng

Journal:

IEEE Transactions on Consumer Electronics

Year:

1997

Language:

english

File:

PDF, 902 KB

english, 1997

48

[IEEE 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium - San Jose, CA, USA (2007.10.3-2007.10.5)] 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium - Evaluation of Thermal Characteristics and Thermomechanical Reliability of Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions

Wang, Tong Hong, Lee, Chang-Chi, Lai, Yi-Shao, Wang, Ching-Chun

Year:

2007

Language:

english

File:

PDF, 3.26 MB

english, 2007

49

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

Yeh, Chang-Lin, Yeh, Yung-Yi, Kao, Jen-Chieh, Wang, Tong Hong, Lee, Chang-Chi, Tong, Ho-Ming

Year:

2013

Language:

english

File:

PDF, 1002 KB

english, 2013

50

Low resistance WSix-based ohmic contacts on n-type GaN

Pan, Chang-Chi, Chen, Ming-Shung, Lee, Chia-Ming, Chyi, Jen-Inn

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 421 KB

english, 2005

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